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Description
MULTICOMP - MC001808 - Breadboard, 750 Tie Points, 8.3 mm, 99 mm, 82.1 mm
- Breadboard Type: Solderless Breadboard
- Total Number of Tie Points: 750Tie Points
- No. of Distribution Strips / Buses: 3Bus Strips
- No. of Terminal Strips: 2 Terminal Strips
- Board Dimensions (L x W) - Imperial: 3.23" x 3.89"
- Board Dimensions (L x W) - Metric: 82mm x 99mm
- SVHC: No SVHC (27-Jun-2018)
- Board Thickness: 8.3mm
- Board Type: Breadboard
- External Height: 99mm
- External Width: 82.1mm