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MARTIN SMT - VD90.5110 - Solder Pellets, for BGA Reballing, 0.45 mm, 220 °C, 18 g
- Solder Alloy: 96.5, 3, 0.5 Sn, Ag, Cu
- Melting Temperature: 220°C
- Diameter: 0.45mm
- Weight - Metric: 18g
- Weight - Imperial: 0.635oz
- Product Range: -
- SVHC: No SVHC (15-Jun-2015)
- Weight: 18g