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description
MARTIN SMT - VD90.5008 - Solder Pellets, for BGA Reballing, 0.4 mm, 183 °C, 14 g
- Solder Alloy: 63, 37 Sn, Pb
- Melting Temperature: 183°C
- Diameter: 0.4mm
- Weight - Metric: 14g
- Weight - Imperial: 0.494oz
- Product Range: -
- SVHC: No SVHC (15-Jun-2015)
- Weight: 14g